Following the winning philosophy which has characterized its business in testing and assembly for over three decades based on the constant and rapid innovation of its solutions, Seica will attend the Productronica China 2019 exhibition for the first time with products that represent the highest level of technology applied to testing of electronic boards and components.

　　In booth E2/2185 Seica will showcase the Pilot V8 NEXT, which, with its innovative and powerful electrical testing performance, is undoubtedly the most complete flying probing test platform on the market. In its most complete configuration, the Pilot V8 tester will provide up to 20 mobile resources for testing an electronic board, ranging from its 8 standard test probes which can supply up to 2 Amperes, high-resolution cameras for automatic optical inspection, barcode reading, laser sensors, capacitive probes, pyrometers, optical fiber sensors for LEDs, flying connectors for boundary scan and On Board Programming, all the way up to high-frequency probes for measurements over 1.5 GHz (an absolutely unique performance on the market).

　　Highly oriented to medium and high volume production, the Pilot V8 is also available in a fully-automated version, making its vertical architecture perfectly suitable to be combined with board loading/unloading modules, capable of hosting from 1 to 12 board magazines (even of different types). All of the automation modules are standard and available in the Seica catalog. In the HR (high resolution) version, the Pilot V8 allows the system to test very small components, around 30 μm, while the XL version extends the work area from the standard 610 x 540 mm to 800 x 650 mm, providing unique solutions for testing “extra-large” boards.

　　All Seica systems can are “Industry 4.0 Ready”, for connection to Seica’s Industrial Monitoring solution or others, for intelligent integration in all aspects of the manufacturing process including data collection, traceability, interaction with MES, repair operations, ensuring full compatibility with the new standards of the fourth industrial revolution taking place today in production facilities around the world.

　　For more information pls see www.seica.com.

　　2019年2月,，斯特蘭比諾,。憑借在解決方案持續(xù)快速創(chuàng)新的基礎(chǔ)上致力于測(cè)試和裝配業(yè)務(wù)三十多年的成功理念,，Seica將參加2019年上海慕尼黑電子展，屆時(shí)將展出代表應(yīng)用于電路板和元件測(cè)試最高技術(shù)的產(chǎn)品,。

　　在E2 / 2185展臺(tái),，Seica將展示Pilot V8 NEXT機(jī)型，該機(jī)型具有創(chuàng)新和強(qiáng)大的電氣測(cè)試性能，無(wú)疑是市場(chǎng)上性能最完善的飛針測(cè)試平臺(tái),。由于其全面的配置,，Pilot V8測(cè)試機(jī)將提供多達(dá)20個(gè)用于測(cè)試電子板的移動(dòng)資源，包括8個(gè)可提供高達(dá)2安培的標(biāo)準(zhǔn)測(cè)試探頭,，用于自動(dòng)光學(xué)檢測(cè)的高分辨率攝像頭,，讀碼器， 激光傳感器,，電容探頭,，高溫計(jì),，用于LED的光纖傳感器,，用于邊界掃描和在板編程的移動(dòng)連接探頭，一直到可用于1.5 GHz以上的測(cè)量高頻探頭,，是市場(chǎng)上擁有絕對(duì)獨(dú)特性能的產(chǎn)品,。

　　為了高度滿(mǎn)足中型和大批量生產(chǎn)客戶(hù)的需求，PILOT V8 NEXT還可以提供全自動(dòng)化機(jī)型,，其立式架構(gòu)更適合于與板塊裝卸載模塊的結(jié)合,，能夠容納1到12個(gè)板卡的框箱（即使是不同型號(hào)的板塊）。所有自動(dòng)化模塊都是標(biāo)準(zhǔn)配置,，可在Seica商品目錄中找到,。Pilot V8 HR（高分辨率）機(jī)型能夠測(cè)試大約30微米的非常小的元器件，而XL型號(hào)測(cè)試機(jī)則是將工作區(qū)域從標(biāo)準(zhǔn)610 x 540 mm擴(kuò)展到800 x 650 mm,，為測(cè)試“超大”板提供了獨(dú)特的解決方案,。

　　Seica所有系統(tǒng)都具備 “工業(yè)4.0 ”特征，能夠用于對(duì)接Seica工業(yè)監(jiān)控解決方案或其他方案,，實(shí)現(xiàn)制造過(guò)程各個(gè)方面的智能集成,，包括數(shù)據(jù)收集、可追蹤性,、與MES的互動(dòng),、維修操作，確保在當(dāng)今發(fā)生的第四次工業(yè)革命的新標(biāo)準(zhǔn)上與世界各地生產(chǎn)設(shè)備完全兼容,。