嵌入式技術(shù)無處不在——無論是在汽車、數(shù)據(jù)和通信系統(tǒng),、工業(yè)和消費(fèi)電子產(chǎn)品還是航空航天領(lǐng)域,。
作為嵌入式行業(yè)經(jīng)濟(jì)發(fā)展和歐盟工業(yè)發(fā)展的晴雨表,embedded world(德國(guó))國(guó)際嵌入式展,,數(shù)十年始終致力于全面展示整個(gè)嵌入式行業(yè),。無論是電子系統(tǒng)安全,、分布式智能、物聯(lián)網(wǎng)還是電子移動(dòng)和能源效率,,展會(huì)范圍覆蓋全產(chǎn)業(yè)鏈,,并齊聚重量級(jí)的行業(yè)領(lǐng)軍企業(yè)帶來嵌入式領(lǐng)域的最新技術(shù)和服務(wù),使embedded world成為全球嵌入式行業(yè)不可錯(cuò)過的盛會(huì),。
受全球疫情影響,,2021年(德國(guó))國(guó)際嵌入式展及同期兩場(chǎng)大會(huì)最終確定將完全以線上數(shù)字化形式呈現(xiàn)。3月1-5日,,來自全球的超過300家嵌入式企業(yè)將與所有觀眾匯聚線上平臺(tái),,展示最新的技術(shù)及產(chǎn)品的同時(shí),借助科技手段,,實(shí)現(xiàn)零距離的交互對(duì)話,。
參展企業(yè)與產(chǎn)品
據(jù)官方統(tǒng)計(jì),截止至2月中旬,,來自全球共超過300家參展企業(yè)已確定將在embedded world 2021 DIGITAL上進(jìn)行產(chǎn)品展示及在線上商務(wù)洽談,。其中包含22家中國(guó)的嵌入式企業(yè),中國(guó)及其他國(guó)際參展企業(yè)列舉如下:
22家參展中國(guó)企業(yè)
參展國(guó)際企業(yè)包括英特爾,、亞德諾半導(dǎo)體(ADI),、貿(mào)澤電子與微軟等,以下為完整參展企業(yè)列表(排名不分先后):
Exhibitor List
Arm Ltd
AAEON Technology Europe B.V.
ACTRON AG
AdaCore SAS
ADATA Technology Co., Ltd.
ADLINK Technology GmbH
admatec GmbH elektronische Systeme und Komponenten
OOO “LABS”
ADVANTECH Europe B.V.
Aetina Corporation
AFV Media Serv SRL
Agile Analog Ltd TKO Marketing Consultants
aicas GmbH
Akasa Asia Corp.
Allied Vision Technologies GmbH
Alternative Embedded Innovation AG
Altia Europe GmbH
Amphenol - BSI
Analog Devices GmbH
Andes Technology Corporation
ANHUI Geniatech INC., LTD
Apacer Technology B.V.
ARBOR Technology Corp.
Art of Technology AG
ASRock Industrial Computer Corporation
Auriga, Inc.
Amazon Web Services, Inc.
Axivion GmbH
b-plus GmbH
Basler AG
Beacon EmbeddedWorks
Beetlebox Limited
BentoNet GmbH
Beta LAYOUT GmbH
Sarl BG INGENIERIE
Biwin Storage Technology CO., LTD
QNX Software Systems GmbH 7360 QNX Software Systems GmBH BlackBerry
Bluetooth SIG, Inc.
Both Harvest Technology Co., Ltd.
C&T Solution Inc.
Candera GmbH
Canonical Group Ltd
Cavli Wireless Inc
Cervoz Technology Co., Ltd.
CETECOM GmbH
ChipCraft Sp. z o.o.
Christ Electronic Systems GmbH
Cincoze Co., Ltd.
CodeClinic LLC
Collabora Ltd.
Compal Electronics, Inc.
Conclusive Engineering Sp. z o.o.
congatec GmbH
Connect Tech Inc.
CoreIoT Technologies Ltd.
Crank Software
Critical Section GmbH
Crystal Group
CTC Advanced GmbH
CTX Thermal Solutions GmbH
DAB-Embedded BVBA Electronic design house
Data I/O GmbH
Datakey
DAVE s.r.l.
DELTA COMPONENTS GmbH
Deutschmann Automation GmbH & Co.KG
DH electronics GmbH
DMB Technics Deutschland GmbH
DSP Systeme GmbH
dSPACE GmbH
e-GITS GmbH
e-peas SA
EAGLE INNOVATION Co. Ltd.
EBV Elektronik GmbH & Co. KG
eesy-ic GmbH
Elatec GmbH
ELECTRONIC ASSEMBLY GmbH
Electronic Specifier Ltd
EMCOMO Solutions AG
EDT-EUROPE ApS Emerging Display Technologies Corp
emlix GmbH
emotas embedded communication GmbH
emtrion GmbH
esd electronics gmbh
eSOL Co., Ltd.
Eurocircuits GmbH
Eurofins Product Service GmbH
Eurotech S.p.A.
EverFocus Electronics Corporation
F&S Elektronik Systeme GmbH
Farnell GmbH
Fast Sense Studio
Fibocom Wireless Inc.
Foundries.io Limited
Fractus Antennas SL
froglogic GmbH
Garz & Fricke GmbH
General Touch Co., Ltd.
GigaDevice Semiconductor Inc.
Ginzinger electronic systems GmbH
G?PEL electronic GmbH
Green Hills Software
SAS GreenWaves Technologies
HAGIWARA Solutions Co., Ltd.
Hailo
HAINZL Industriesysteme GmbH
Haltian Oy
HARTING Deutschland GmbH & Co. KG
Hartmann Electronic GmbH
HDL Design House
Hi-Lo System Research Co. Ltd.
Hilscher Gesellschaft für Systemautomation mbH
Hitex GmbH
IAR Systems AB
IBASE Technology Inc.
IBV - Echtzeit- und Embedded GmbH & Co. KG
IC'Alps
iesy GmbH
Imperas Software Ltd.
Infineon Technologies
infoteam Software AG
Innodisk Corporation
InoNet Computer GmbH
IOOS BE
ISCUE GmbH & Co. KG
Ito Europe GmbH
Jinan USR IOT Technology Limited
Jungo Connectivity Ltd
KARO electronics GmbH
Keith & Koep GmbH
KEY TECHNOLOGY (CHINA) LIMITED LIMITED
Kimoto LTD
KIOXIA Europe GmbH
Kontron Europe GmbH
Kudan Inc.
L-Tek d.o.o.
Lattice Semiconductor
Lauterbach GmbH
LDRA Limited
LEGIC Identsystems AG
Lemberg Solutions LLC
Lenovo OEM Solutions
Liancheng Touch-China Electronics Co.,Ltd.
Litemax Electronics Inc.
Logic Technology B.V.
Lorit Consultancy GmbH
Luchengtech Co., Ltd.
LUMINEQ Displays
macio GmbH
The MathWorks GmbH
Maxim Integrated
Memfault
mentec GmbH
Merraky Engineering Solutions Private Limited
Micro Crystal AG
Micron Technology, Inc.
Microsoft
Mikroelektronika d.o.o.
Mildex Optical Inc.
MiTAC Digital Technology Corporation
Mouser Electronics, Inc.
MSI (Micro-Star International)
MVTec Software GmbH
near-shoring.com c/o DC Services GmbH
Neoway Technology Co., Ltd
Netac Technology Co., Ltd
NewTec GmbH System-Entwicklung und Beratung
Nodka Automation Technology Co.,Ltd
Nordic Semiconductor
nVent - Schroff GmbH
NXP Semiconductors B.V.
On Semiconductor Limited
Open Source Automation Development Lab (OSADL) eG
OpenHW Group
OpenSystems Media Embedded Computing Design
Parasoft Deutschland GmbH
PHOENIX CONTACT GmbH & Co.KG
Phytec Messtechnik GmbH
PLANET Technology Corporation
PLS GmbH
PolyIC GmbH & Co. KG
Portwell
Powertip Technology Corporation
PQShield Ltd
Premo Germany GmbH
PricewaterhouseCoopers GmbH
Pro-Data International Corp.
Proant AB
Proculus Technologies Limited
PROFIBUS Nutzerorganisation e.V. PROFIBUS & PROFINET International (PI)
ProvenRun
PSA Certified
QA Systems GmbH
Qbic Technology Co., Ltd.
Qoitech AB
Qorvo
Quectel Wireless Solution Co.,Ltd.
Real-Time Innovations (RTI)
Renata SA
Renesas Electronics Europe GmbH
ReSys d.o.o.
RISC-V International
Robert Bosch GmbH
Roche Diagnostics Automation Solutions GmbH
RockTouch Enterprise Co., Ltd
ROHM Semiconductor GmbH
Roundsolutions GmbH & Co. KG
RRC power solutions GmbH
RTSoft GmbH Software for Intelligent Things
Rutronik Elektronische Bauelemente GmbH
Samtec Europe GmbH
Schlei?heimer Soft- und Hardwareentwicklung GmbH
SD Card Association
SECO S.p.A.
SEGGER Microcontroller GmbH
Semtech Corporation
Shenzhen Geshem Technology Co., Ltd
Shenzhen Huntkey Electric Co., Ltd.
Shenzhen JHC Technology Development Co., Ltd.
Shenzhen KingSpec Electronics Technology Co., Ltd.
Sibros
Siemens EDA part of Siemens Digital Industries Software
Siemens Embedded
Siemens Industry Software GmbH
Silicon Motion, Inc.
Silicon Radar GmbH
Sofia Europa
SOFICS BVBA
Solectrix GmbH
SparkLAN Communications Inc.
SparxSystems Software GmbH
SSV Software Systems GmbH
STMicroelectronics International NV
Swindon Silicon Systems Ltd.
Swissbit AG
SYS TEC electronic AG
Systerel SAS
tacterion GmbH
Taoglas Ltd
TASKING Germany GmbH
TDK Corporation
TeamViewer Germany GmbH
TenAsys Europe GmbH
Texas Instruments Deutschland GmbH
Texim Europe GmbH
The Qt Company Oy
Third pin
Thundercomm Technology Co., Ltd.
Tianma Microelectronics Co., Ltd.
TOPPAN PRINTING CO., LTD.
Toradex AG
TQ-Systems GmbH
Trande UG
Trenz Electronic GmbH
Truphone Ltd
TrustInSoft SAS
T?V Informationstechnik GmbH T?V NORD GROUP
Tul Corporation
Tuxera Oy
u-blox AG
U-Experten UX Gruppe GmbH und Co. KG
UD INFO Corp.
Ujet Engineering GmbH
UL GmbH
Ultratronik Vertriebs GmbH
Unisystem Sp.z o.o.
VARTA Microbattery GmbH
Vector Informatik GmbH
Versinetic
Vision Components GmbH
Wanshih Electronic Co., Ltd.
WEKA FACHMEDIEN GmbH
WinSystems Inc.
WIZnet Co., Ltd.
Yaskawa Europe GmbH
Z-Com, Inc.
Zentel EMEA e.K.
Zephyr Project c/o The Linux Foundation
Zhejiang JC Antenna Co.,LTD
ZKTeco Deutschland GmbH
此次參展企業(yè)將展示產(chǎn)品的涵蓋嵌入式全產(chǎn)業(yè)鏈,包含:
展會(huì)亮點(diǎn)早知道
此次展會(huì)還有哪些其他亮點(diǎn)值得關(guān)注,?
01
兩大國(guó)際一流大會(huì),,聚焦行業(yè)前沿話題
同期將舉辦全球嵌入式領(lǐng)域兩大尖端會(huì)議--embedded world Conference國(guó)際嵌入式大會(huì)及electronic display Conference電子顯示屏大會(huì),5天共超過200場(chǎng)主題演講,,聚焦技術(shù)發(fā)展的前沿話題,。
02
頂級(jí)專家小組,在線分享嵌入式發(fā)展和創(chuàng)新
展會(huì)期間,,由全球嵌入式行業(yè)的頂級(jí)專家們將在線就5大熱點(diǎn)話題展開深入討論,。觀眾有機(jī)會(huì)參與專家小組的探討,了解行業(yè)發(fā)展及技術(shù)創(chuàng)新,。
嵌入式人工智能(3月1日)
中小項(xiàng)目的痛點(diǎn)—安全性及保密性(3月2日)
嵌入式視覺—?jiǎng)?chuàng)造客戶價(jià)值的成功要素(時(shí)間待定)
多元化團(tuán)隊(duì)如何推動(dòng)創(chuàng)新(3月4日)
嵌入式人工智能(時(shí)間待定)
物聯(lián)網(wǎng)中的嵌入式連接(時(shí)間待定)
03
首度關(guān)注中國(guó)市場(chǎng),,國(guó)內(nèi)外專家共同探討《中國(guó)及其在全球半導(dǎo)體價(jià)值鏈中的角色》
兩大會(huì)議重點(diǎn)關(guān)注
同期兩大會(huì)議分別將關(guān)注哪些熱點(diǎn)話題?
軟件與系統(tǒng)工程,,物聯(lián)網(wǎng),,自動(dòng)駕駛系統(tǒng),最新顯示技術(shù)和應(yīng)用……
德國(guó)奧芬堡大學(xué)的Axel Sikora教授作為國(guó)際嵌入式大會(huì)的主席,,介紹此次國(guó)際嵌入式大會(huì)時(shí)說到:“嵌入式系統(tǒng)是一門跨學(xué)科的技術(shù),,涉及眾多領(lǐng)域,。因此,在2021年國(guó)際嵌入式大會(huì)(embedded world Conference)上將討論的主題非常廣泛,,涵蓋:物聯(lián)網(wǎng),、硬件、軟件和系統(tǒng)工程,、安全與保障,、片上系統(tǒng)設(shè)計(jì)、嵌入式視覺,、人機(jī)交互,、有線和無線數(shù)據(jù)傳輸或自動(dòng)駕駛系統(tǒng)等”。此次大會(huì)議題除了每天固定包含歷年來的熱門話題--“軟件與系統(tǒng)工程以外”,,也將探討“物聯(lián)網(wǎng)”相關(guān)的趨勢(shì)話題,、以及特定應(yīng)用芯片、嵌入式視覺及人機(jī)界面的開發(fā)等諸多專業(yè)主題,。另外,,議題中涵蓋的“自動(dòng)駕駛系統(tǒng)”,充分體現(xiàn)了嵌入式系統(tǒng)技術(shù)正越來越多地從研究和原型階段轉(zhuǎn)向?qū)嶋H應(yīng)用階段,。
2021年電子顯示屏大會(huì)將再次強(qiáng)調(diào)顯示屏作為嵌入式系統(tǒng)主要?jiǎng)?chuàng)新組件的重要性,。此次會(huì)議的亮點(diǎn)將包括關(guān)于顯示市場(chǎng)、最新顯示技術(shù)和應(yīng)用的各種主題演講,,以及大量關(guān)于汽車顯示屏的會(huì)議,。此外,會(huì)上將演示包括:micro-LEDs,、OLED,、觸摸屏、基于手勢(shì)的控制和觸覺界面,、顯示測(cè)量技術(shù)和顯示優(yōu)化等最新產(chǎn)品及技術(shù),。來自德國(guó)普福爾茨海姆大學(xué)的Karlheinz Blankenbach教授,作為本次顯示屏大會(huì)的顧問委員會(huì)主席,,特別指出:“電子顯示屏大會(huì)是歐洲最重要的顯示技術(shù)B2B平臺(tái),,作為針對(duì)行業(yè)專家的高端會(huì)議,展示了顯示行業(yè)的創(chuàng)新實(shí)力和活力,?!?/p>
發(fā)現(xiàn)嵌入式行業(yè)最新技術(shù)及產(chǎn)品
來自全球300多家企業(yè)將帶來最新的產(chǎn)品和技術(shù),觀眾可通過展商列表和產(chǎn)品列表瀏覽全部參展企業(yè)及產(chǎn)品信息(文字,、圖片及視頻),。
與產(chǎn)品/技術(shù)專家在線交流
觀眾和參展企業(yè)可借助平臺(tái)配對(duì)系統(tǒng),快速精準(zhǔn)定位高匹配度目標(biāo),,并通過在線交流工具(文字聊天及視頻會(huì)議)實(shí)現(xiàn)零距離即時(shí)商務(wù)洽談,,建立長(zhǎng)期聯(lián)系,。
獲取行業(yè)前沿信息,加入熱點(diǎn)話題探討
觀眾可在同期會(huì)議板塊,,找到并參與專家或參展企業(yè)發(fā)起的主題演講,、圓桌討論、展商論壇等活動(dòng),,獲得行業(yè)前沿信息,,加入熱點(diǎn)話題討論。