X頻段接收組件三維SiP微系統(tǒng)設(shè)計
2020年電子技術(shù)應(yīng)用第7期
付 浩,劉德喜,,祝大龍,,齊偉偉
北京遙測技術(shù)研究所,北京100094
摘要: 針對X頻段多波束相控陣組件小型化、模塊化的設(shè)計需求,結(jié)合多芯片組件技術(shù)、微波毫米波高密度垂直互連技術(shù),,利用HFSS對半開放式準同軸引腳進行優(yōu)化設(shè)計,同時采用上下腔三維布局方式,,設(shè)計了以ML-SL-SL-CPWG和ML-SL-CPWG作為無引線引腳的小型化X頻段接收組件SiP微系統(tǒng)模塊,。接收組件增益≥32.8 dB,噪聲系數(shù)≤3.0 dB,,整個模塊體積僅為12.5 mm×15 mm×5.4 mm,,較原有二維平面鏈路系統(tǒng)面積縮小了63%,體積縮小了76%,,同時模塊化設(shè)計在系統(tǒng)應(yīng)用中具有極大的優(yōu)勢,。
中圖分類號: TN454
文獻標識碼: A
DOI:10.16157/j.issn.0258-7998.191396
中文引用格式: 付浩,劉德喜,,祝大龍,,等. X頻段接收組件三維SiP微系統(tǒng)設(shè)計[J].電子技術(shù)應(yīng)用,2020,,46(7):7-9,,14.
英文引用格式: Fu Hao,Liu Dexi,,Zhu Dalong,,et al. Design of 3D SiP microsystems for X-band receive[J]. Application of Electronic Technique,2020,46(7):7-9,,14.
文獻標識碼: A
DOI:10.16157/j.issn.0258-7998.191396
中文引用格式: 付浩,劉德喜,,祝大龍,,等. X頻段接收組件三維SiP微系統(tǒng)設(shè)計[J].電子技術(shù)應(yīng)用,2020,,46(7):7-9,,14.
英文引用格式: Fu Hao,Liu Dexi,,Zhu Dalong,,et al. Design of 3D SiP microsystems for X-band receive[J]. Application of Electronic Technique,2020,46(7):7-9,,14.
Design of 3D SiP microsystems for X-band receive
Fu Hao,,Liu Dexi,Zhu Dalong,,Qi Weiwei
Beijing Research Institute of Telemetry,,Beijing 100094,China
Abstract: Aiming at the design requirements of miniaturization and modularization of X-band multi-wave phased array components, this paper designs a SiP receiving module combining multi-chip module technology and microwave millimeter wave high-density vertical interconnection technology. Using HFSS to optimize the design of the semi-open quasi-coaxial structure, and using the three-dimensional layout of the double sided multi-cavity, the ML-SL-SL-CPWG and ML-SL-CPWG were designed as the no-lead pins for the X-band receiving SiP module. Receiver component gain≥32.8 dB, noise figure≤3.0 dB. And the module volume is only 12.5 mm×15 mm×5.4 mm,,which is 63% area smaller and 76% volume smaller than the original two-dimensional planar system. At the same time, modular design has great advantages in system application.
Key words : receiving components,;system in package;HTCC,;miniaturization
0 引言
組件作為相控陣系統(tǒng)核心關(guān)鍵部分,,占據(jù)著整機尺寸的一大部分,其成本甚至可以高達整個相控陣系統(tǒng)的60%[1],。隨著射頻微波電路的快速發(fā)展,,傳統(tǒng)的二維獨立封裝集成方式很難滿足現(xiàn)在系統(tǒng)需求,對組件模塊的小型化,、多芯片模塊技術(shù)(Microwave Multi-chip Module,,MMCM),、系統(tǒng)級封裝(System in Package,,SiP)以及射頻鏈路三維集成提出了更高的要求[2]。針對當前復(fù)雜的電磁環(huán)境以及全空域多波束的測控需求,,研究和設(shè)計體積更小,、成本更低、性能更優(yōu),、可靠性更高的組件具有重要意義,。
本文應(yīng)用SiP技術(shù)中多芯片封裝技術(shù)(Multi-Chip Package,MCP)將X頻段接收組件射頻鏈路進行了如圖1所示的上下腔三維小型化高密度封裝,,大大縮減了組件模塊體積,,可實現(xiàn)對X頻段左、右旋來波信號的濾波,、低噪聲放大,、數(shù)控移相及衰減,最終形成四波束輸出,,供后端進行數(shù)據(jù)處理,。
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作者信息:
付 浩,劉德喜,,祝大龍,,齊偉偉
(北京遙測技術(shù)研究所,北京100094)
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