中圖分類號： TN409 文獻標(biāo)識碼： A DOI：10.16157/j.issn.0258-7998.211819 中文引用格式： 胡長征,，馬偉，高清運,，等. 一種新型自毀芯片監(jiān)測和執(zhí)行電路的設(shè)計[J].電子技術(shù)應(yīng)用,，2022，48(2)：23-27. 英文引用格式： Hu Changzheng,，Ma Wei,，Gao Qingyun，et al. Design of a new type of self-destruct chip monitoring and execution circuit[J]. Application of Electronic Technique,，2022,，48(2)：23-27.
Design of a new type of self-destruct chip monitoring and execution circuit
Hu Changzheng，Ma Wei,，Gao Qingyun,，Hu Weibo
College of Electronic Information and Optical Engineering，Nankai University,，Tianjin 300350,，China
Abstract： In the current self-destruction technology, the self-destruction monitoring method is single, the self-destruction execution is long, and the self-destruction is incomplete and unstable, which leads to the low success rate of self-destruction. A real-time monitoring and execution circuit system with both self-destruction monitoring and execution is designed. The circuit system designed two self-destruct monitoring methods, packaging and disassembly and power-on timing, which made the self-destruct monitoring methods more diverse and the results more accurate. At the same time, MOS tube was used as the switching characteristic to reduce the time of self-destruct execution. The experimental results show that the circuit system can carry out real-time monitoring of the working chip through the self-destruct monitoring circuit when the supply voltage is 3.3 V and the storage voltage of tantalum capacitor is 20 V. Meanwhile, the test results show that the time from the monitoring to the self-destruct signal to the start of the self-destruct execution is 0.28 ms.
Key words : self-destruction chip,；real-time self-destruction monitoring；self-destruction execution
