中圖分類號(hào)： TN92 文獻(xiàn)標(biāo)識(shí)碼： A DOI：10.16157/j.issn.0258-7998.222677 中文引用格式： 劉昊東，吳洪江,，余小輝,，等. 基于三維集成的小型化Ku波段收發(fā)組件[J].電子技術(shù)應(yīng)用，2022,，48(5)：119-124,，128. 英文引用格式： Liu Haodong，Wu Hongjiang,，Yu Xiaohui,，et al. Miniaturized Ku-band transceiver based on 3D integration technology[J]. Application of Electronic Technique,，2022，48(5)：119-124,，128.
Miniaturized Ku-band transceiver based on 3D integration technology
Liu Haodong,，Wu Hongjiang，Yu Xiaohui,，Ma Zhangang
The 13th Research Institute,，CETC，Shijiazhuang 050051,，China
Abstract： With silicon-based 3D integrated module and multilayer hybrid pressing printed circuit board(PCB) technique, a miniaturized Ku-band transceiver was designed, and meanwhile its principle project and approach were expounded. The transceiver employed 3D integrated structure. Radio frequency(RF) and intermediate frequency(IF) chips and their periphery circuits were integrated in 3D heterogeneous integrated module. Outer circuit board was made of a mixed-laminated multi-layer PCB. The transceiver used ball grid array(BGA) to connect 3D module and PCB. Signal transmission structure was optimized to reduce transmission loss and improve isolation among the channels. Product test indicates that the transceiver meet the requirements of inter-channel amplitude consistency, intra-band flatness, noise factor and other indicators. Besides, the transceiver has conformed to practical needs such as miniaturization, high integration, high consistency and high producibility.
Key words : 3D integrated,；transceiver；Ku-band,；vertical interconnection
