Abstract： The TSV, pipeline, sales and micro-module of the micro-system components are carried out from the parameter settings modeling, DC voltage drop analysis and AC impedance analysis of DDR3 power delivery network, signal analysis methods, criteria. Collaborative design based on chip package system is completed combined with the chip power model and PCB boards. The paper proposes a method for setting component parameters, power integrity DC simulation and AC low impedance design method, and complete cascade connection analysis method of DDR3 signal integrity. The effect of the method is perfect obtained from the DDR3 time domain analysis and timing script, and the research can guide the micro-system PISI analysis and the layout optimization.
Key words : micro-system components；CPS,；PDN,；cascade
