《電子技術應用》
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金屬封裝微系統(tǒng)內部高壓擊穿和爬電問題的點云分析方法
電子技術應用
王輅,,柏晗,,曾燕萍,丁濤杰
中國電子科技集團公司第五十八研究所,,江蘇 無錫 214000
摘要: 面對金屬封裝高壓隔離微系統(tǒng)內部潛在的擊穿和爬電風險,,結合高精度建模和圖論思想建立一種新的可靠性分析方法,,為產(chǎn)品的設計和測試提供有力保障,。首先,,將微系統(tǒng)三維模型轉化為點云模型,經(jīng)濾波和曲面重構形成可計算的數(shù)值模型,;之后,,根據(jù)幾何特征和物理關系,將表面爬電問題和擊穿問題分別等效為測地路徑和歐氏路徑的計算,;并根據(jù)微系統(tǒng)布局方式優(yōu)化Dijkstra算法,計算封裝后的擊穿和爬電路徑,;最終,,參考實驗標準判斷產(chǎn)品風險等級。對照實驗結果與計算匹配,,精度理想,,表明該方法對微系統(tǒng)相關問題的有效性。
中圖分類號:TN406 文獻標志碼:A DOI: 10.16157/j.issn.0258-7998.234255
中文引用格式: 王輅,,柏晗,,曾燕萍,,等. 金屬封裝微系統(tǒng)內部高壓擊穿和爬電問題的點云分析方法[J]. 電子技術應用,2024,,50(2):38-42.
英文引用格式: Wang Lu,,Bai Han,Zeng Yanping,,et al. A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package[J]. Application of Electronic Technique,,2024,50(2):38-42.
A point cloud analysis method for high-voltage breakdown and creepage inside metal-encapsulated system-in-package
Wang Lu,,Bai Han,,Zeng Yanping,Ding Taojie
The 58th Research Institute of China Electronics Technology Group Corporation,, Wuxi 214000,, China
Abstract: This paper combines high-precision modeling and graph theory ideas to establish a novel reliability analysis method, which provides a strong guarantee for product design and testing, for analyzing the potential risk of breakdown and creepage inside the high-voltage isolated system-in-package products. Firstly, the 3D model of the product is converted into a point cloud model, and a computable numerical model is formed through filtering and surface reconstruction. Then, according to the geometric characteristics and physical relations, the surface creepage problem and breakdown problem are equivalent to the calculation of geodesic path and Euclidean path, respectively. According to the layout, the Dijkstra algorithm is optimized to calculate the breakdown and creepage paths after packaging. Finally, the product risk level is judged by reference to the experimental standards.
Key words : system-in-package;point cloud analysis,;Dijkstra algorithm,;high-voltage breakdown;high-voltage creepage

引言

微系統(tǒng)技術將多個半導體芯片整合到一個封裝中,,并通過各種封裝技術將它們電氣互連,,以創(chuàng)建接近片上系統(tǒng)的系統(tǒng),但具有更好的良率,、更高的靈活性和更快的上市時間[1],。將高壓隔離芯片、控制器,、配置電路等模塊集成為微系統(tǒng)形態(tài)能夠明顯縮小產(chǎn)品尺寸,、提升場景適應性。然而,,在有限空間下,,產(chǎn)品封裝后將引入鍵合線、管殼,、蓋板,、焊柱等其他金屬結構,是否會因此產(chǎn)生新的擊穿行為行業(yè)內尚無方法能夠分析確定,,卻是這類微系統(tǒng)器件在設計時必須予以考慮的可靠性因素,。


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作者信息:

王輅,柏晗,,曾燕萍,,丁濤杰

中國電子科技集團公司第五十八研究所,江蘇 無錫 214000


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